| PART |
Description |
Maker |
| 0465577445 |
1.27mm (.050) by 1.27mm (.050) Pitch SEARAY* Slim Receptacle, 100 Circuits, 7.50mm (.295) Unmated Height, 4 Rows, With Pegs, Solder Charge?/a> Lead Free
|
Molex Electronics Ltd.
|
| 2-103168-3 2-103168-8 1-103168-0 1-103168-1 1-1031 |
HDR ASSY, MOD II, SHROUDED, 4 SIDES, DBL ROW, VERTICAL, .100X.100, WITH .025 SQ POSTS
HDR ASSY, MOD II, SHROUDED, 4 SIDES, DBL ROW, VERTICAL, .100 x .100, WITH .025 SQ POSTS
|
Tyco Electronics
|
| 0015921100 015-92-1100 SDA-71660-1100 716601100 |
1.27mm (.050) Pitch EBBI?/a> 50D Receptacle, Vertical, 100 Circuits
1.27mm (.050) Pitch EBBI 50D Receptacle, Vertical, 100 Circuits
1.27mm (.050) Pitch EBBI垄芒 50D Receptacle, Vertical, 100 Circuits
|
Molex Electronics Ltd.
|
| 90136-2210 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| SHTSHC-1 |
.100 cl Shrouded Terminal Strip Header Custom
|
Major League Electronics
|
| 15-80-0121 A-70567-0004 0015800121 705670004 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| MSBT MSTT MSEG MSBHG MSBHT MSDAT MSAT |
MINI SHUNTS .050 & .100 [2.54] CENTERLINE
|
Adam Technologies, Inc.
|
| 15-80-0065 0015800065 70567-0137 A-70567-0137 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0083 0015800083 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0123 0015800123 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0105 0015800105 A-70567-0139 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
|
